Products

DESCRIPTION

Basic Info.

Model NO.	A01
Lead Time	1-2 Weeks
Certificate	RoHS, ISO 9001, ISO 14001, GB/T 29490
Delivery Method	Air Freight
Transport Package	Bulk, Waffle Box, Tape and Reel, Film-Wrap Package
Specification	Au80Sn20 Preform
Trademark	XianYi
Origin	Guangzhou
HS Code	7115901020
Production Capacity	10000000

Product Description

Introducing our exquisite Solder Preforms Au80Sn20, meticulously engineered for the demanding requirements of Laser Diode Packaging, seamlessly blending Gold-Tin Solder to meet your highest standards. AuSn Solder Preforms

Features:
- This exceptional eutectic solder boasts a precise melting temperature of 280 ºC,
- offering superb wettability combined with remarkable strength for the most reliable connections.
- Impeccable thermal and electrical properties, ensuring optimal performance in all applications.
- Designed for high reliability and unwavering stability, even under the most challenging conditions.

Description:
Au80Sn20 is a premium eutectic alloy with an impressive melting temperature of 280ºC. Perfectly adaptable, it can be crafted into a wide variety of shapes and sizes of preforms, tailored to meet diverse requirements. Au80Sn20 is perfectly suited for applications demanding exceptional high temperature strength and thermal fatigue resistance, enhancing
product longevity. It offers the advantages of outstanding wettability, superior tensile strength, and robust corrosion resistance. With a melting point nearest to high leadsolder, Au80Sn20 provides the ability to effectively prevent the corrosion of gold plating and pad shedding during the soldering process on gold or palladium-silver pads. When compared to lead-free eutectic solder with lower melting points, our solder ensures enhanced stability and reliability for critical applications.ty.

Au80Sn20 eutectic solder does not required flux in soldering, avoiding contamination and corrosion of semiconductor chips caused by flux use. Au80Sn20 are mainly used in the packaging of optoelectronics, high reliability and high-power electronic devices.

Solder Composition:

Element	Wt%
Gold (Au)	Margin
Tin (Sn)	20.0 ± 0.5

Physical Properties:

Product name	Melting point/ºC solid / liquid phase	Density g/cm3	Resistivity µΩ·m	Thermal conductivity W/m·K	Thermal expansion coefficient 10-6/ºC	Tensile strength Mpa
Au80Sn20	280	14.52	0.224	57	16	276

Method of Use:

Reflow Profile

Reflow profile of Au80Sn20 Solder Preforms
(For reference only, the reflow profile should be adjusted according to the actual soldering situation)

Plating Thickness of Pads
A gold plating thickness ranging from 0.8~ 1.5μm is recommended for soldering.


Operation Details:
- Picking up:
Use an anti-static tools to pick up the solder to prevent solder contamination and deformation.

- Operating environment:

Atmosphere	Parameter requirements
N2	Oxygen concentration(200~ 1000ppm)
Vacuum	Vacuum degree ≤ 2.0×10-3Pa

- Flux Compatibility:
Au80Sn20 solder is compatible with regular no-clean and water-soluble electronic grade fluxes currently.

Dimension Tolerance:

Thickness(t)	Typical tolerances for length, width or diameter(L/W/D)
t <0.40mm	±0.02mm
0.40mm≤ t <1.00mm	±0.03mm
t ≥1.00mm	±0.05mm
Thickness(t)	Thickness (t)
	Conventional solder alloys	Indium alloy
t<0.05mm	±0.005mm	±0.01mm
0.05mm≤ t <0. 10mm	±0.008mm	±0.01mm
0. 10mm≤ t <0.20mm	±0.01mm
0.20mm≤ t <0.40mm	±0.02mm
0.40mm≤ t <1.00mm	±0.03mm
t ≥1.00mm	±5%

Storage and Product Management:
- Storage
The best storage temperature of this product is 25±5 ºC, and the relative humidity is no higher than 55%RH.

- Product management
Keep container tightly closed when product is not in use.

Safety:
- Please use this product with adequate ventilation and certain personal protection conditions.- Please do not mix with other toxic chemicals.

List of Common Solders

Category	Products	Solidus(ºC)	Liquidus(ºC)	Density (g/cm3)	Resistivity (μΩ·m)	Thermal Conductivity (W/m ·K)	CTE (10-6/ºC)	Tensile Strength (MPa)
Solder Metal	In51Bi32.5Sn16.5	/	60(e)	7.88	0.522	/	22	33.44
	In66.3Bi33.7	/	72(e)	7.99	/	/	/	/
	Bi50Pb28Sn22	/	100(e)	9.44	/	/	/	/
	In52Sn48	/	118(e)	7.3	0. 147	34	20	12
	In50Sn50	118	125	7.3	0. 147	34	20	11.86
	Bi58Sn42	/	138(e)	8.56	0.383	19	15	55. 16
	Bi57Sn42Ag1	138	140	8.57	/	/	/	/
	In97Ag3	/	143(e)	7.38	0.075	73	22	5.5
	Sn43Pb43Bi14	144	163	9.02	/	/	24	44. 1
	In80Pb15Ag5	149	154	7.85	0. 133	43	28	17.58
	Sn53Pb37Bi10	150	168	8.65	/	/	/	/
	Sn70Pb18In12	154	167	7.79	0. 141	45	24	36.68
	In100	/	157(mp)	7.31	0.072	86	29	1.88
	In70Pb30	165	175	8. 19	0. 195	38	28	23.79
	In60Pb40	174	185	8.52	0.246	29	27	28.61
	Sn77.2In20Ag2.8	175	187	7.25	0. 176	54	28	46.88
	Sn62Pb36Ag2	/	179(e)	8.42	0. 145	42	27	44
	Sn63Pb37	/	183(e)	8.4	0. 146	51	25	52
	In50Pb50	184	210	8.86	0.287	22	27	32.2
	Pb60In40	197	231	9.3	0.331	19	26	34.48
	Sn86.9In10Ag3. 1	201	205	7.37	/	/	/	/
	Au10Sn90	/	217(e)	7.78	/	/	/	50.2
	SAC387(Sn95.5Ag3.8Cu0.7)	/	217(ne)	7.4	0. 132	57	22	48
	SAC305(Sn96.5Ag3.0Cu0.5)	217	218	7.37	0. 132	58	21	50
	Sn96.5Ag3.5	/	221(e)	7.37	0. 108	33	30	39
	Sn99.3Cu0.7	/	227(e)	7.31	/	/	/	/
	Sn100	/	232(mp)	7.29	0. 111	73	24	13. 1
	Sn65Ag25Sb10	/	233(e)	7.8	/	/	36	117.2
	Sn95Sb5	235	240	7.25	0. 145	28	31	40.7
	Sn90Sb10	240	250	7.22	/	42	27	44
	Pb75In25	240	260	9.97	0.375	18	26	37.58
	Pb88Sn10Ag2	268	290	10.75	0.203	27	29	22.48
	Pb90Sn10	275	302	10.75	/	/	24.6	32
	Au80Sn20	/	280(e)	14.52	0.224	57	16	276
	Pb92.5Sn5Ag2.5	287	296	11.02	0.2	29	24	29.03
	Pb90Sn5Ag3In2	294	297	10.89	/	/	/	/
	Pb92.5In5Ag2.5	300	310	11.02	0.313	25	25	31.44
	Au88Ge12	/	361(e)	14.67	0. 151	44	13.4	185
	Au96.8Si3.2	/	363(e)	15.4	/	27	12	255
	Au98Si2	363	390	16.92	/	/	/	/
Brazing Metal	Ag60Cu30Sn10	600	720	9.58	/	/	/	/
	Ag72Cu28	/	780(e)	10	/	352	17.8	250-360
	Ag50Cu50	780	870	9.67	/	/	/	/
	Au60Ag20Cu20	835	845	13.79	/	/	/	/
	Ag92.5Cu7.5	/	/	10.37	/	/	/	/
	Au80Cu20	/	910(e)	15.67	/	/	/	/
	Au50Cu50	955	970	12.22	/	/	/	/
	Ag100	/	961(mp)	10.49	0.0163	429	/	180
	Au100	/	1064(mp)	19.3	0.0221	318	14	138
	Cu100	/	1083(mp)	8.96	0.0172	401	/	246

*Note : In this table, "e" indicates eutectic alloys, "ne" indicates near eutectic alloys and "mp" indicates the melting point of simple substance. Other alloys can be customized for your requirement. For more details please contact us.